Electronic Microcircuits: 13162832-1, 13163127, 131745-1
| MFG SKU | NSN | Item Name | Details | Manufacturer (CAGE) | RFQ |
|---|---|---|---|---|---|
| 13162832-1 131628321 | 5962-01-198-2032 | Microcircuit, Linear | Inclosure Configuration: Dual-in-line Design Function and Quantity: 1 converter, dc | U S Army Aviation and Missile (18876) | |
| 13162832-2 131628322 | 5962-01-198-2033 | Microcircuit, Linear | Inclosure Configuration: Dual-in-line Design Function and Quantity: 1 converter, dc | U S Army Aviation and Missile (18876) | |
| 13163123 | 5962-01-221-1824 | Microcircuit, Digital | U S Army Aviation and Missile (18876) | ||
| 13163124 | 5962-01-221-1825 | Microcircuit, Digital | U S Army Aviation and Missile (18876) | ||
| 13163127 | 5962-01-167-1335 | Microcircuit, Digital | III End Item Identification: 1240-01-172-4521 Test Data Document: 18876-13163127 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing) | Raytheon Company (82577) U S Army Aviation and Missile (18876) | |
| 131633-1 1316331 | 5962-01-336-3851 | Microcircuit, Digital | Criticality Code Justification: ZZZY Reference Number Differentiating Characteristics: Material will be in accordance with ships parts control center activity hx quality control, manufacturing and testing specifications | Lockheed Martin Corporation (94271) | |
| 13169-020 13169020 | 5962-01-365-0272 | Microcircuit, Memory | Symbol Technologies Inc. (64928) Telxon Corp. (30347) | ||
| 13170634-1 131706341 | 5962-01-102-5314 | Microcircuit, Memory | Inclosure Configuration: Dual-in-line Operating Temp Range: -55.0 to 125.0 deg celsius Features Provided: Hermetically sealed and burn in and high performance and monolithic and W/enable and schottky and W/storage | U S Army Aviation and Missile (18876) | |
| 13170692-1 131706921 | 5962-01-175-2478 | Microcircuit | U S Army Aviation and Missile (18876) | ||
| 13170881-2 131708812 | 5962-01-293-5968 | Microcircuit, Digital-Linear | Inclosure Configuration: Dual-in-line Operating Temp Range: -55.0 to 125.0 deg celsius Features Provided: Hermetically sealed and monolithic | U S Army Aviation and Missile (18876) | |
| 13170887 | 5962-01-122-6966 | Microcircuit, Linear | Inclosure Configuration: CAN Operating Temp Range: -55.0 to 150.0 deg celsius Features Provided: Hermetically sealed and adjustable and high voltage and high power | U S Army Aviation and Missile (18876) | |
| 13170887-1 131708871 | 5962-01-239-4123 | Microcircuit, Linear | Inclosure Configuration: CAN Operating Temp Range: -55.0/+125.0 deg celsius Features Provided: Hermetically sealed and monolithic and adjustable | U S Army Aviation and Missile (18876) | |
| 13170887-2 131708872 | 5962-01-180-4268 | Microcircuit, Linear | Inclosure Configuration: CAN Operating Temp Range: -55.0 to 125.0 deg celsius Features Provided: Hermetically sealed and monolithic and adjustable | U S Army Aviation and Missile (18876) | |
| 13170999-1 131709991 | 5962-01-155-1463 | Microcircuit, Digital | Inclosure Configuration: Dual-in-line Operating Temp Range: -55.0 to 125.0 deg celsius Features Provided: Hermetically sealed and monolithic | U S Army Aviation and Missile (18876) | |
| 13171000-1 131710001 | 5962-01-104-5439 | Microcircuit, Linear | Body Outside Diameter: 0.335 inches minimum and 0.370 inches maximum Body Height: 0.165 inches minimum and 0.185 inches maximum Operating Temp Range: -55.0/+125.0 deg celsius | U S Army Aviation and Missile (18876) | |
| 13171007-1 131710071 | 5962-00-615-6101 | Microcircuit, Linear | Inclosure Configuration: CAN Operating Temp Range: -55.0 to 125.0 deg celsius Features Provided: Monolithic and hermetically sealed and negative outputs and positive outputs and internally compensated | U S Army Aviation and Missile (18876) | |
| 13171084-1 131710841 | 5962-01-175-2612 | Microcircuit, Digital | Inclosure Configuration: Dual-in-line Operating Temp Range: -55.0 to 125.0 deg celsius Features Provided: Hermetically sealed and burn in and low power and high performance and bidirectional | Semiconductor Engineering (0AEZ3) U S Army Aviation and Missile (18876) | |
| 13171104 | 5962-01-347-5046 | Microcircuit Assembly | III End Item Identification: 1425-01-106-3089 Test Data Document: 18876-13171104 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing) | U S Army Aviation and Missile (18876) | |
| 13171104-1 131711041 | 5962-01-271-1321 | Microcircuit, Digital | Semiconductor Engineering (0AEZ3) U S Army Aviation and Missile (18876) | ||
| 131745-1 1317451 | 5962-01-336-3852 | Microcircuit, Digital | Criticality Code Justification: ZZZY Reference Number Differentiating Characteristics: Material will be in accordance with ships parts control center activity hx quality control, manufacturing and testing specifications | Lockheed Martin Corporation (94271) |